Lead frame for semiconductor devices

Details Lead frame for semiconductor devices Lead frame for semiconductor devices

1999-04-23

2000-10-24

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, H01L 23495

Patent

active

061371602

ABSTRACT:
To provide a lead frame for semiconductor devices which is structured so as to prevent extension of separation caused on the interface between a semiconductor element and a semiconductor element die pad or the interface between the semiconductor element die pad and sealing resin into the sealing resin while slits function as anchor, a lead frame comprises a planer semiconductor element die pad for supporting a semiconductor element and has slits extending through the semiconductor element die pad from the semiconductor element supporting side to the back side. The slit is formed so that the side wall surfaces are inclined gradually to the inside or outside increasingly from the semiconductor element supporting side to the back side on the central areas, and is formed so that the respective side wall surfaces are inclined gradually in the inverse relation to the side wall surface of the central areas from the semiconductor element supporting side to the back side on the areas of both ends.

REFERENCES:
patent: 4797726 (1989-01-01), Manabe
patent: 4918511 (1990-04-01), Brown
patent: 4942452 (1990-07-01), Kitano et al.
patent: 5150193 (1992-09-01), Yashuhara et al.
patent: 5175610 (1992-12-01), Kobayashi
patent: 5233222 (1993-08-01), Djennas et al.
patent: 5847446 (1998-12-01), Park et al.
patent: 5874773 (1999-02-01), Terada et al.

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