Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent
1991-02-26
1993-06-22
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
257677, 361421, 174 522, H01L 2328, H01L 2348, H01L 2944
Patent
active
052218597
ABSTRACT:
A lead frame of a plastic encapsulated type semiconductor device is provided with a coating film which has a solderability higher than a solderability of a basic metal of the lead frame, and the coating film has a corrosion potential higher than a corrosion potential of the basic metal. The coating film protects the basic metal from corrosion caused by the plastic encapsulated member. The coating film of the lead frame made of a Fe-Ni alloy is an alloy comprising metal selected from Mo, W, Au, Cr, Cu, metals of the platinum group and a metal selected from Fe, Co, and Ni.
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patent: 3839660 (1974-10-01), Stryker
patent: 4785137 (1988-11-01), Samuels
patent: 4894752 (1990-01-01), Murata et al.
patent: 4942454 (1990-07-01), Mori et al.
patent: 4974052 (1990-11-01), Ichiyama
patent: 5010388 (1991-04-01), Sasame et al.
Itoh Masahiko
Kazama Narutoshi
Kobayashi Shiro
Ohnaka Noriyuki
Hille Rolf
Hitachi , Ltd.
Ostrowski David
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