Lead frame for integrated circuits

Details Lead frame for integrated circuits Lead frame for integrated circuits

1994-03-31

1996-01-23

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257748, 257750, 257762, 257766, 257768, 361813, H01L 2348, H01L 2352, H01L 2940, H05K 502

Patent

active

054867215

ABSTRACT:
Lead frames completely surface-plated with palladium have a nickel-phosphorus or copper-tin layer between the base element, made for example of copper, and the palladium layer. Such lead frames exhibit good bondability and good solderability without tinning.

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