Lead frame for a semiconductor device comprising inner leads hav

Details Lead frame for a semiconductor device comprising inner leads hav Lead frame for a semiconductor device comprising inner leads hav

1995-10-10

1998-09-15

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257784, 257786, 257787, H01L 23495

Patent

active

058083545

ABSTRACT:
A semiconductor chip package includes a semiconductor chip, a lead frame including a plurality of inner leads each having a wire bonding point on a top surface, bonding wires for electrically interconnecting the semiconductor chip to each of the plurality of inner leads, and a molding compound for encapsulating the semiconductor chip and the inner leads. Each of the plurality of inner leads of the lead frame has a means for locking movement of the molding compound against the top surfaces of the inner leads, and the locking means, for example a linear groove, down set feature of the inner lead or second wire ball, is placed in close proximity to the wire bonding.

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Development of an Alternative Wire Bond Test Technique, Michael Pecht et al, 1994 IEEE, Part A, vol. 17, No. 4, Dec. 1994, pp. 610-615.

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