Lead frame for a multiplicity of terminals

Details Lead frame for a multiplicity of terminals Lead frame for a multiplicity of terminals

1992-09-28

1993-12-14

Clark, Sheila V.

Compositions

Radioactive compositions

Nuclear reactor fuel

257775, H01L 2948, H01L 2944, H01L 2952, H01L 2960

Patent

active

052705706

ABSTRACT:
A lead frame for a multiplicity of terminals, in particular of large-scale integrated semiconductor chips, arranged in a very confined space and consisting of metallic conductors which converge from large outer spacings toward the terminals and can be connected to the terminals. The lead frame allows a high number of terminals with a low degree of spacing of the conductors to be produced. The conductors are produced in the outer region by a conventional production method and at their ends pointing toward the terminals by laser cutting of a uniformly metallic material.

REFERENCES:
patent: 4405875 (1983-09-01), Nagai
patent: 4514750 (1985-04-01), Adams
patent: 4711700 (1987-12-01), Cusak
patent: 4733292 (1988-03-01), Jarvis
patent: 4872260 (1989-10-01), Johnson et al.
Patterson et al., "Laser Dambar And Flash Removal For Plastic Molded Surface Mount Components With Lead Spacing Under 20 Mills", Fifth IEEE/CHMT Int'l Electronic Manufacturing Technology Symposium, Oct. 10-12 1988, pp. 18-21.

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