Lead frame coining for semiconductor devices

Details Lead frame coining for semiconductor devices Lead frame coining for semiconductor devices

1998-08-14

2000-05-02

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438106, 438121, H01L 2144, H01L 2148, H01L 2150

Patent

active

060571764

ABSTRACT:
A semiconductor device comprises a semiconductor die having a circuit side and a lead frame having a plurality of lead fingers. Each of the lead fingers comprises a first side having a generally planar first portion which overlies the die and a second side having a first surface and a second surface discontinuous or noncoplanar with the first surface. The circuit side of the die is attached to the second surface. The first side, the first surface and the second surface have generally parallel planes. A distance through each finger from the first side to the first surface is greater than a second distance through the finger from the first side to the second surface.

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