Lead frame coining for semiconductor devices

Details Lead frame coining for semiconductor devices Lead frame coining for semiconductor devices

1995-07-31

1998-08-18

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257692, 257775, H01L 23495

Patent

active

057961581

ABSTRACT:
A semiconductor device comprises a semiconductor die having a circuit side and a lead frame having a plurality of lead fingers. Each of the lead fingers comprises a first side having a generally planar first portion which overlies the die and a second side having a first surface and a second surface discontinuous or noncoplanar with the first surface. The circuit side of the die is attached to the second surface. The first side, the first surface and the second surface have generally parallel planes. A distance through each finger from the first side to the first surface is greater than a second distance through the finger from the first side to the second surface.

REFERENCES:
patent: 4205548 (1980-06-01), Bothner et al.
patent: 5256598 (1993-10-01), Farnworth et al.
patent: 5286342 (1994-02-01), Tsuji
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5343616 (1994-09-01), Roberts
patent: 5357139 (1994-10-01), Yaguchi et al.
patent: 5358906 (1994-10-01), Lee
patent: 5451813 (1995-09-01), Kazutaka
patent: 5457071 (1995-10-01), Dombroski

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