Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Patent
1996-08-14
1999-04-27
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
257676, 257666, 257735, H01L 23495, H01L 2348
Patent
active
058982256
ABSTRACT:
An integrated circuit package includes an integrated circuit chip having first and second opposing faces and a plurality of pads on the first face of the integrated circuit chip. A plurality of external pins is also included along with a plurality of wires, a respective one of which electrically connects a respective external pin to a respective pad. A conductive lead frame is located adjacent and electrically contacting the second face of the integrated circuit chip. A first wire electrically connects a select one of the pads to the conductive lead frame. A second wire electrically connects a selected one of the pins to the conductive lead frame. Accordingly, power can be distributed to an integrated circuit package with reduced variation across the chip.
REFERENCES:
patent: 3698082 (1972-10-01), Hyltin et al.
patent: 4714952 (1987-12-01), Takekawa et al.
patent: 4891687 (1990-01-01), Mallik et al.
patent: 4937656 (1990-06-01), Kohara
patent: 5012323 (1991-04-01), Farnworth
patent: 5235207 (1993-08-01), Ohi et al.
patent: 5237202 (1993-08-01), Shimizu et al.
patent: 5309019 (1994-05-01), Moline et al.
patent: 5365409 (1994-11-01), Kwon et al.
patent: 5386141 (1995-01-01), Liang et al.
patent: 5479050 (1995-12-01), Pritchard et al.
patent: 5576577 (1996-11-01), Takenouchi et al.
patent: 5598031 (1997-01-01), Groover et al.
European Search Report, Application No. EP 96 11 3017, Aug. 27, 1998.
Arroyo Teresa M.
Samsung Electronics Co,. Ltd.
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