Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent
1999-02-16
2000-01-18
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
438111, 438121, H01L 2144
Patent
active
060157232
ABSTRACT:
An integrated circuit package includes an integrated circuit chip having first and second opposing faces and a plurality of pads on the first face of the integrated circuit chip. A plurality of external pins is also included along with a plurality of wires, a respective one of which electrically connects a respective external pin to a respective pad. A conductive lead frame is located adjacent and electrically contacting the second face of the integrated circuit chip. A first wire electrically connects a select one of the pads to the conductive lead frame. A second wire electrically connects a selected one of the pins to the conductive lead frame. Accordingly, power can be distributed to an integrated circuit package with reduced variation across the chip.
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Picardat Kevin M.
Samsung Electronics Co,. Ltd.
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