Lead frame assembly including a semiconductor device and a resis

Details Lead frame assembly including a semiconductor device and a resis Lead frame assembly including a semiconductor device and a resis

1993-02-23

1996-10-08

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257690, 257784, H01L 23495

Patent

active

055634419

ABSTRACT:
A semiconductor device assembly includes a lead frame having opposed first and second surfaces, a die pad, and a plurality of inner leads, each of two inner leads having an integral projection; a semiconductor element mounted on the die pad; a resistance wire welded to the projections; and metal wires electrically connecting said the semiconductor element with the inner leads.

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