Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent
1997-08-12
2000-08-22
Williams, Alexander O.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With stress relief
257688, 257666, 257676, 257698, 257696, 257673, 257780, H01L 2348, H01L 23495, H01L 2352, H01L 2940
Patent
active
061076783
ABSTRACT:
In a lead frame with a reinforcing ring surrounding a semiconductor element which are electrically connected to leads through electrodes is integrally formed through suspending portions, reinforcing portions for reinforcing the suspending portions are provided on the suspending portiones. Upon application of a lead frame forming technique in which a laminate plate of three or more layers is used as a base, and inner leads are formed at one side while outer leads are formed by the surface layer at the other side, the lead frame is formed by forming a ring in place of outer leads, for example. A semiconductor package is formed by mounting the lead frame on a semiconductor chip.
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Ito Makoto
Makino Haruhiko
Osawa Kenji
Sato Kazuhiro
Shigeta Hiroyuki
Sony Corporation
Williams Alexander O.
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