Lead frame and semiconductor device employing the same with impr

Details Lead frame and semiconductor device employing the same with impr Lead frame and semiconductor device employing the same with impr

1979-07-05

1981-11-17

James, Andrew J.

357 72, 357 68, H01L 2348, H01L 2944, H01L 2952

Patent

active

043014640

ABSTRACT:
This invention relates to a lead frame which is applied to a resin-molded semiconductor device. According to the lead frame of this invention, a quadrangular tab for supporting a semiconductor pellet is supported by four tab leads which extend along diagonal lines of the tab.

REFERENCES:
patent: 3842492 (1974-10-01), Kamerbeek
patent: 3926746 (1975-12-01), Hargis
patent: 4023053 (1977-05-01), Shimizu et al.
patent: 4109096 (1978-08-01), Dehaine
patent: 4138691 (1979-02-01), Bonkohara et al.

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