Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2008-08-18
2010-06-08
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S123000, C438S940000, C257SE21151
Reexamination Certificate
active
07732258
ABSTRACT:
A lead frame and a method of fabricating a semiconductor package including the lead frame, where the lead frame includes a die pad, a tie bar supporting the die pad, and a plurality of leads. The leads may include inner and outer leads arranged along an outer periphery of the die pad, with each of the inner and outer leads having tip terminals. The lead frame may include a connecting bar connected to tip terminals of each of the inner leads. In the method, a bonding pad of a semiconductor chip is mounted on the die pad and connected via a conductive wire to the inner leads of the lead frame. The semiconductor chip, wire and inner leads may be subjected to a molding process, and the connecting bar which connects the tip terminals of the inner leads may be cut so as to independently separate each of the inner leads from the die pad.
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Fourson George
Harness & Dickey & Pierce P.L.C.
Samsung Electronics Co,. Ltd.
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