Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate
2008-05-29
2010-10-05
Tran, Thien F (Department: 2895)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With stress relief
C257S676000
Reexamination Certificate
active
07808086
ABSTRACT:
The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.
REFERENCES:
patent: 2003/0006492 (2003-01-01), Ogasawara et al.
patent: 2003/0071333 (2003-04-01), Matsuzawa
patent: 2003/0127711 (2003-07-01), Kawai et al.
patent: 2005/0093118 (2005-05-01), Itou et al.
patent: 2002-26190 (2002-01-01), None
Hasegawa Noriyuki
Saiki Akimi
Sato Kouji
Shoji Hiroyuki
Takahashi Gousuke
Hitachi Cable Precision Co., Ltd.
NEC Electronics Corporation
Sughrue & Mion, PLLC
Tran Thien F
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