Lead frame and a process for the production of a lead with this

Details Lead frame and a process for the production of a lead with this Lead frame and a process for the production of a lead with this

1988-03-28

1990-01-09

James, Andrew J.

357 68, H01L 2348, H01L 3300

Patent

active

048931691

ABSTRACT:
A lead frame adapted for a plurality of semiconductor chips in which, for each semiconductor chip, at least one electric terminal is extended out of the package after encapsulation of the lead frame. In addition, a process for the production of a lead with this lead frame, enables a full automation of the lead assembly and good, reliable production. The lead frame has at least one mechanical node (T1, T2, T3, T4; T) at which, by severing a single reinforced node, at least three electric conductors (1, 2, G; 3, 4, G; 5, 6, G; 7, 8, G; 21, 22, 23) are electrically separated from one another.

REFERENCES:
patent: 3899305 (1975-08-01), Hilgers
patent: 4312926 (1982-01-01), Burns
patent: 4380042 (1983-04-01), Angelucci, Sr. et al.
patent: 4477827 (1984-10-01), Walker et al.
patent: 4587548 (1986-05-01), Grabbe et al.
Milliken, IBM Technical Disclosure Bulletin, "Electrode Pattern", vol. 11, No. 7, Dec./68, p. 850.

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