Lead frame

Details Lead frame Lead frame

1997-01-21

2000-06-20

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257673, 257692, 257693, 257734, 257737, 257738, 257780, 257781, 257705, 257706, 257697, H01L 23495, H01L 2348

Patent

active

060780975

ABSTRACT:
In a lead frame, leads are formed on a surface of protective insulation film having a device hole. Protruding electrodes (solder balls) are formed on the surface of the leads opposite the surface closer to the protective insulation film. A reinforcement plate is also formed on the rear surface of the protective insulation film.

REFERENCES:
patent: 5409865 (1995-04-01), Karnezos
patent: 5608265 (1997-03-01), Kitano et al.

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