Lead formation usings grids

Details Lead formation usings grids Lead formation usings grids

1998-10-29

2000-05-16

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438123, 361704, H01L 2144

Patent

active

060636483

ABSTRACT:
A component for making microelectronic units includes a grid of interspersed leads with ends of the various leads being connected to one another by frangible elements. One end of each lead is bonded to a top element and the other end of each lead is bonded to a bottom element. The top and bottom elements are moved away from one another, thereby breaking the frangible elements and deforming the leads towards a vertically extensive disposition. A flowable composition such as dielectric material may be injected around the leads during or after the moving step. The resulting unit may be used to form permanent or temporary connections between microelectronic elements.

REFERENCES:
patent: 5210939 (1993-05-01), Mallik et al.
patent: 5420461 (1995-05-01), Mallik et al.
patent: 5438477 (1995-08-01), Pasch
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 5557501 (1996-09-01), DiStefano et al.
patent: 5650914 (1997-07-01), DiStefano et al.
patent: 5798286 (1998-08-01), Faraci et al.
patent: 5821608 (1998-10-01), DiStefano et al.
patent: 5904498 (1999-05-01), Fjelstad
patent: 5913109 (1999-06-01), DiStefano et al.
patent: 5989936 (1999-11-01), Smith et al.

Affiliated with

Also associated with

Rating

Lead formation usings grids does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead formation usings grids, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead formation usings grids will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-258223