Layered structure of a substrate, a dielectric layer and a singl

Active solid-state devices (e.g. – transistors – solid-state diode – Specified wide band gap semiconductor material other than... – Diamond or silicon carbide

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257 70, 257 78, 257103, 257201, H01L 310312, H01L 27108, H01L 3300, H01L 310328

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055634281

ABSTRACT:
A structure is fabricated comprising a substrate, a dielectric layer formed over the substrate, and a single crystal layer of a compound formed over the dielectric layer. The single crystal layer is formed by the chemical reaction of at least a first element with an initial single crystal layer of a second element on the dielectric layer having an initial thickness of about 100 to about 10,000 angstroms.
According to another aspect, a carbide single crystal layer is provided on a substrate by depositing carbon from a solid carbon source at a low rate and low temperature, followed by reacting the carbon with the underlying layer to convert it to the carbide.

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Steckl et al., SiC Silcon-on-Insulator Structures by Direct Carbonization Conversion and Postgrowth from Silacyclobutane, J. Electrochem. Soc., vol. 141, No. 6 (1994), pp. L66-L68.
Abstract RD-173053, 1994.

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