Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent
1982-06-30
1984-07-31
O'Keefe, Veronica
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
428617, 428628, 428671, 357 68, 357 71, 357 80, H05K 306
Patent
active
044630590
ABSTRACT:
The top surface metallurgy of LSI chip carriers is improved by multiple and phased interface of metal layers which enable such metallurgies to be suitable for joining by solder reflow and wire bonding techniques. The modifications result in separating the solder bonding metallurgy from the fan-out conductor metallurgy with an intermediate layer of a metal such as Cr or Ti which prevents the formation of intermetallic alloys which are mechanically weak or brittle and tend to fracture because of thermal fatigue stresses caused by thermal cycling during either multiple (up to 50) solder bonding reflow operations or operation of the circuit. The fan-out metallurgy conductors are preferably composed of Cr-Cu-Cr layers covered by at least one upper metal layer which is separated from the Cu of the conductor by means of a metal such as phased layers of Cr or Ti deposited before the other upper metal layer or layers. Solder ball bonding surfaces are composed of additional metal in the form of Au, Cu and Ni. The solderless bonding surfaces are composed of a metal selected from Au, Cr, Ti, Al and Co.
REFERENCES:
patent: 3607379 (1971-09-01), Leinkram et al.
patent: 3777220 (1973-12-01), Tatusko et al.
patent: 3843911 (1974-10-01), Horton et al.
patent: 4231154 (1980-11-01), Gazdik et al.
Bhattacharya Somnath
Chance Dudley A.
Koopman Nicholas G.
Ray Sudipta K.
International Business Machines - Corporation
Jones II Graham S.
O'Keefe Veronica
LandOfFree
Layered metal film structures for LSI chip carriers adapted for does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Layered metal film structures for LSI chip carriers adapted for , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Layered metal film structures for LSI chip carriers adapted for will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-185783