Layered devices having surface curvature and method of construct

Details Layered devices having surface curvature and method of construct Layered devices having surface curvature and method of construct

1987-08-21

1989-12-05

Dees, Jose G.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156625, 156645, 1566591, 156662, 156663, 5116572, 51283R, 51310, 51326, 430314, 430321, 430323, 430324, 427162, 427165, 427167, 350607, 350629, B05D 506, G02B 510, B44C 122

Patent

active

048850551

ABSTRACT:
A method of treating a substrate having first and second sides with corresponding oppositely facing first and second surfaces, to produce curvature in the first surface. The method includes the steps of removing material, according to a predetermined pattern, from the second side of the substrate, and applying a stress-producing film of material to at least one surface of the substrate to thereby cause the substrate to bend to produce the desired curvature in the first surface.

REFERENCES:
patent: 3772102 (1973-11-01), Tiemann et al.
patent: 3904274 (1975-09-01), Feinleib et al.
patent: 4155631 (1979-05-01), Borsare et al.
patent: 4298247 (1981-11-01), Michelet et al.
patent: 4299445 (1981-12-01), Aucouturier
patent: 4426440 (1984-01-01), Thompson
patent: 4524127 (1985-06-01), Kane
patent: 4598039 (1986-07-01), Fischer et al.
patent: 4684565 (1987-08-01), Abeles et al.
patent: 4714668 (1987-12-01), Uneno et al.
patent: 4724043 (1988-02-01), Bergendahl et al.
"Curved Silicon Substrates for Multilayered Structure", SPIE vol. 691, X-ray Imaging II (1986) by Woodbury et al.

Affiliated with

Also associated with

Rating

Layered devices having surface curvature and method of construct does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Layered devices having surface curvature and method of construct, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Layered devices having surface curvature and method of construct will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2032602