Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal
Patent
1998-11-04
2000-08-15
Whitehead, Jr., Carl
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
438 29, 438607, 438962, H01L 2120
Patent
active
061035408
ABSTRACT:
A single crystal silicon film nanostructure capable of optical emission is aterally disposed on an insulating transparent substrate of sapphire. By laterally disposing the nanostructure, adequate support for the structure is provided, and the option of fabricating efficient electrical contact structures to the nanostructure is made possible. The method of the invention begins with the deposition of ultrathin layers of silicon on the substrate. A Solid Phase Epitaxy improvement process is then used to remove crystalline defects formed during the deposition. The silicon is then annealed and thinned using thermal oxidation steps to reduce its thickness to be on the order of five nanometers in height. The width and length of the nanostructure are defined by lithography. The nanometer dimensioned silicon is then spin-coated with a resist with width and length definition in the resist being performed by way of electron beam exposure. The photoresist is developed and the e-beam written pattern is transferred to the silicon by etching. Oxidations and etchings may subsequently be employed to further thin the width of the nanostructure to be on the order of two to three nanometers. The single crystal, silicon-based nanostructures can be made an integral part of silicon-based photo, electroluminescent, and quantum-effect devices all of which are compatible with current silicon manufacturing techniques and with other silicon-based microelectronics.
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de la Houssaye Paul R.
Dubbelday Wadad B.
Dynes Robert C.
Katz Andrew S.
Russell Stephen D.
Fendelman Harvey
Jr. Carl Whitehead
Kagan Michael A.
Lin Yung A.
Lipovsky Peter A.
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