Active solid-state devices (e.g. – transistors – solid-state diode – With means to increase breakdown voltage threshold – In integrated circuit
Reexamination Certificate
2007-04-17
2007-04-17
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
With means to increase breakdown voltage threshold
In integrated circuit
C257S493000, C257S343000, C257S141000, C257S122000
Reexamination Certificate
active
10859564
ABSTRACT:
A voltage booster transistor with an optimal conducting path formed in widebandgap semiconductors like Silicon Carbide and Diamond, is provided as a power transistor with a voltage rating >200V. Contrary to conventional vertical design of power transistors, a higher, optimum doping for a given thickness supports higher Source/Drain blocking voltage. A topside and backside gate region of the opposite conductivity type than the channel region providing control of source to drain current path through a small gate voltage. The backside gate and the Drain junction are able to support the rated blocking voltage of the device.
REFERENCES:
patent: 5264713 (1993-11-01), Palmour
patent: 5329142 (1994-07-01), Kitagawa et al.
patent: 5459089 (1995-10-01), Baliga
patent: 6100549 (2000-08-01), Weitzel et al.
patent: 6281521 (2001-08-01), Singh
patent: 6573128 (2003-06-01), Singh
patent: 6600375 (2003-07-01), Morse et al.
patent: 2001/0024138 (2001-09-01), Dohnke et al.
patent: 2002/0190258 (2002-12-01), Harada et al.
patent: 2003/0168704 (2003-09-01), Harada et al.
patent: 2003/0168919 (2003-09-01), Friedrichs et al.
C Hatfield et al., “DC 1-V Characteristics and RF Performance of a 4H-SiC JFET at 773K,” IEEE Transactions on Electron Devices, vol. 45, No. 9, Sep. 1998.
D. Alok et al., “4H-SiC RF Power MOSFETS,” IEEE Electron Device Letters, vol. 22, No. 12, Dec. 2001.
R. Singh et al., “High Temperature SiC Trench Gate p-IGBTs,” IEEE Transactions on Electron Devices, vol. 50, No. 3, Mar. 2003.
S. Banerjee et al., “1300-V 6H-SiC Lateral MOSFETs with two RESURF Zone,” IEEE Electron Device Letters, vol. 23, No. 10, Oct. 2002.
R. Singh et al., “SiC Power Schottky and PiN Diodes,”IEEE Transactions on Electron Devices, vol. 49, No. 4, Apr. 2002.
R. Singh et al., “Development of High-Current 4H-SiC ACCUFET,” IEEE Transactions on Electron Devices, vol. 50, No. 2, Feb. 2003.
Trew et al., “The Potential of Diamond and SiC Electronic Devices for Microwave and Millimeter-Wave Power Applications,” Proceedings of the IEEE, vol. 79, No. 5, May 1991.
Clarke et al., “SiC Microwave Power Technologies,” Proceedings of the IEEE, vol. 90, No. 6, May 2002.
B. Jayant Baliga, “Trends in Power Semiconductor Devices,” IEEE Transactions on Electron Devices, vol. 43, No. 10, Oct. 1996.
Friedricks et al., “Stacked high voltage switch based on SiC VJEFTs,” ISPSD, Cambridge, UK, Apr. 14-17, 2003.
G. Kelner et al., “High Temperature Operation of a-Silicon Carbide Buried Gate Junction Field-Effect Transistors,” Electronics Letters, vol. 27, No. 12, Jun. 6, 1991.
Meneghesso et al., “Trap Characterization in Buried-Gate N-Channel 6H-SiC JFETs,” IEEE Electron Device Letters, vol. 22, No. 9, Sep. 2001.
Rozario et al., “Thermal Cycling Study of SiC BGJFETs,” IEEE 1998.
B. Weis et al., “Turn-off and short curcuit behaviour of 4H SiC JFETs,” IEEE 2001.
Bodendorf Andrew
Pert Evan
Tran Tan
WidebandGap LLC
LandOfFree
Lateral super junction field effect transistor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Lateral super junction field effect transistor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lateral super junction field effect transistor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3764343