Lateral diode with multiple spacers

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S367000, C257SE27051, C257SE29195, C257SE29328, C438S237000, C438S508000

Reexamination Certificate

active

06967363

ABSTRACT:
Various circuit devices, including diodes, and methods manufacturing therefor are provided. In one aspect, a method manufacturing is provided that includes forming a gate structure on a semiconductor portion of a substrate. The semiconductor portion has a first conductivity type. First and spacer structures are formed on opposite sides of the gate structure. A first impurity region of a second conductivity type is formed proximate the first spacer structure while the semiconductor portion lateral to the second spacer structure is masked. The first impurity region and the semiconductor portion define a junction. A width of the second spacer structure is reduced while the second spacer structure and the first impurity region are masked. A second impurity region of the first conductivity type is formed in the semiconductor portion proximate the second spacer structure. The method provides a diode with reduced series resistance.

REFERENCES:
patent: 5036017 (1991-07-01), Noda
patent: 5510280 (1996-04-01), Noda
patent: 6074906 (2000-06-01), Cheek et al.
patent: 6506642 (2003-01-01), Luning et al.
patent: 2001/0011744 (2001-08-01), Sung
patent: 2005/0035410 (2005-02-01), Yeo et al.
Dallas Semiconductor;Compensating for Ideality Factor and Series Resistance Differences between Thermal Sense Diodes; www.maxim-ic.com/an1057; Apr. 17, 2002; pp. 1-2.
Intel;Intel Pentium® III Processor, Thermal Diode; http://support.intel.com/support/processors/pentiumiii/sb/CS-007590.htm; Aug. 12, 2003; pp. 1-3.

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