Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2011-07-12
2011-07-12
Fulk, Steven J (Department: 2891)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C257S415000, C257SE21309, C200S181000
Reexamination Certificate
active
07977137
ABSTRACT:
A process for making a latching zip-mode actuated mono wafer MEMS switch especially suited to capacitance coupled signal switching of microwave radio frequency signals is disclosed. The single wafer fabrication process used for the switch employs sacrificial layers and liquid removal of these layers in order to also provide needed permanent physical protection for an ultra fragile switch moving arm member. Latched operation of the achieved MEMS switch without use of conventional holding electrodes or magnetic fields is also achieved. Fabrication of a single MEMS switch is disclosed however large or small arrays may be achieved. A liquid removal based fabrication process is disclosed.
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Cortez Rebecca
Ebel John L.
Leedy Kevin D.
Strawser Richard E.
Strawser, legal representative Donald E.
AFMCLO/JAZ
Fulk Steven J
Krieger Daniel J.
The United States of America as represented by the Secretary of
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