Laser processing method and laser processing apparatus

Details Laser processing method and laser processing apparatus Laser processing method and laser processing apparatus

2006-01-31

2006-01-31

Thompson, Craig A. (Department: 2813)

Semiconductor device manufacturing: process

Radiation or energy treatment modifying properties of...

Compound semiconductor

C438S795000, C438S007000, C438S463000, C700S121000

Reexamination Certificate

active

06992026

ABSTRACT:
A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

REFERENCES:
patent: 4562333 (1985-12-01), Taub et al.
patent: 5254833 (1993-10-01), Okiyama
patent: 5543365 (1996-08-01), Wills et al.
patent: 5622540 (1997-04-01), Stevens
patent: 5637244 (1997-06-01), Erokhin
patent: 5776220 (1998-07-01), Allaire et al.
patent: 5826772 (1998-10-01), Ariglio et al.
patent: 6055829 (2000-05-01), Witzmann et al.
patent: 6175096 (2001-01-01), Nielsen
patent: 6211488 (2001-04-01), Hoekstra et al.
patent: 6252197 (2001-06-01), Hoekstra et al.
patent: 6257224 (2001-07-01), Yoshino et al.
patent: 6259058 (2001-07-01), Hoekstra
patent: 6322958 (2001-11-01), Hayashi
patent: 6420678 (2002-07-01), Hoekstra
patent: 6489588 (2002-12-01), Hoekstra et al.
patent: 2002/0006765 (2002-01-01), Michel et al.
patent: 2003/0024909 (2003-02-01), Hoekstra et al.
patent: 46-24989 (1971-07-01), None
patent: 04-111800 (1992-04-01), None
patent: 07-040336 (1995-02-01), None
patent: 10-163780 (1998-06-01), None
patent: 11-138896 (1999-05-01), None
patent: 11-163403 (1999-06-01), None
patent: 11-177137 (1999-07-01), None
patent: 11-221684 (1999-08-01), None
patent: 11-267861 (1999-10-01), None
patent: 2000-015467 (2000-01-01), None
patent: 2000-219528 (2000-08-01), None
K. Hayashi, “Inner Glass Marking by Harmonics of Solid-state Laser,” Proceedings of 45th Laser Materials Processing Conference, Dec. 1998, pps. 23-28.
T. Sano et al., “Evaluation of Processing Characteristics of Silicon With Picosecond Pulse Laser,” Preprints of the National Meeting of Japan Welding Society, No. 66, Apr. 2000, pp. 72-73.
K. Miura et al., “Formation of Photo-induced Structures in Glasses with Femtosecond Laser,” Proceedings of 42nd Laser Materials Processing Conference, Nov. 1997, pp. 105-111.
T. Miyazaki, “Laser Beam Machining Technology,” published by Sango-Tosho Inc. on May 31, 1991, First Edition, pps. 9-10.
T. Yajima et al.,New Version Laser Handbook, published by Asakura Shoten, Jun. 15, 1989, pp. 666-669 no translation.
Tooling Machine Series, Laser Machining, published by Taiga Shuppan, Inc., Sep. 10, 1990, pp. 91-96 no translation.
Electronic Material, No. 9, on 2002, published by Kogyo Chousakai, pp. 17-21 (with full English translation).
F. Fukuyo et al., “Stealth Dicing Technology for Ultra Thin Wafer”, presented at 2003 ICEP (International Conference on Electronics Packaging), Apr. 16-18, 2003, Tokyo, Japan no translation.

Affiliated with

Also associated with

Rating

Laser processing method and laser processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser processing method and laser processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser processing method and laser processing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3540521