Laser processing method

Details Laser processing method Laser processing method

1998-10-16

1999-10-19

Silbaugh, Jan H.

Plastic and nonmetallic article shaping or treating: processes

Laser ablative shaping or piercing

264 137, B23K 2600

Patent

active

059684410

ABSTRACT:
A laser processing method for ablating a transparent material is disclosed. A laser beam absorption layer is formed in a desired ablation portion beforehand by the implantation of an impurity or the increase of a defect density. The absorption layer obviates damage ascribable to thermal strain and, when use is made of a VUV (Vacuum Ultra Violet) beam, damage to portions other than an irradiated portion. This allows a simple apparatus to implement the ablation of a transparent film.

REFERENCES:
patent: 5424244 (1995-06-01), Zhang et al.
patent: 5495548 (1996-02-01), Bilodeau et al.
patent: 5843363 (1998-12-01), Mitwalsky et al.
J. Zhang et al., "Dual-Beam Ablation of Fused Quartz Using 266 nm and VUV Lasers With Different Delay-Times", Applied Plysics A 64, 477-481, (1997).

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