Laser process

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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Reexamination Certificate

active

06991975

ABSTRACT:
A laser annealing process for recovering crystallinity of a deposited semiconductor film such as of silicon which had undergone morphological damage, said process comprising activating the semiconductor by irradiating a pulsed laser beam operating at a wavelength of 400 nm or less and at a pulse width of 50 nsec or less onto the surface of the film, wherein,said deposited film is coated with a transparent film such as a silicon oxide film at a thickness of from 3 to 300 nm, and the laser beam incident to said coating is applied at an energy density E (mJ/cm2) provided that it satisfies the relation:in-line-formulae description="In-line Formulae" end="lead"?log10N≦−0.02 (E−350),in-line-formulae description="In-line Formulae" end="tail"?where N is the number of shots of the pulsed laser beam.

REFERENCES:
patent: 4059461 (1977-11-01), Fan et al.
patent: 4151008 (1979-04-01), Kirkpatric
patent: 4198246 (1980-04-01), Wu
patent: 4262208 (1981-04-01), Suzki et al.
patent: 4309224 (1982-01-01), Shibata
patent: 4309225 (1982-01-01), Fan et al.
patent: 4370175 (1983-01-01), Levatter
patent: 4379727 (1983-04-01), Hansen et al.
patent: 4431459 (1984-02-01), Teng
patent: 4462150 (1984-07-01), Nishimura et al.
patent: 4468855 (1984-09-01), Sasaki
patent: 4473433 (1984-09-01), Bosch et al.
patent: 4497015 (1985-01-01), Konno et al.
patent: 4500365 (1985-02-01), Mori
patent: 4536231 (1985-08-01), Kasten
patent: 4546009 (1985-10-01), Abeles et al.
patent: 4646426 (1987-03-01), Sasaki
patent: 4861964 (1989-08-01), Sinohara
patent: 4906491 (1990-03-01), Yamazaki
patent: 4937459 (1990-06-01), Ina
patent: 4964720 (1990-10-01), Torigoe
patent: 5180690 (1993-01-01), Czubatyj et al.
patent: 5250931 (1993-10-01), Misawa
patent: 5264383 (1993-11-01), Young
patent: 5306651 (1994-04-01), Masumo et al.
patent: 5347146 (1994-09-01), Soh
patent: 5366926 (1994-11-01), Mei et al.
patent: 5401666 (1995-03-01), Tsukamoto
patent: 5403762 (1995-04-01), Takemura
patent: 5424244 (1995-06-01), Zhang et al.
patent: 5561075 (1996-10-01), Nakazawa
patent: 5591492 (1997-01-01), Hirai et al.
patent: 5699191 (1997-12-01), Fork
patent: 5897799 (1999-04-01), Yamazaki et al.
patent: 5968383 (1999-10-01), Yamazaki et al.
patent: 5986807 (1999-11-01), Fork
patent: 6002101 (1999-12-01), Yamazaki et al.
patent: 6061375 (2000-05-01), Zhang et al.
patent: 6157492 (2000-12-01), Yamazaki et al.
patent: 6159777 (2000-12-01), Takenouchi et al.
patent: 6212012 (2001-04-01), Tanaka
patent: 6215595 (2001-04-01), Yamazaki et al.
patent: 6300176 (2001-10-01), Zhang et al.
patent: 6440785 (2002-08-01), Yamazaki et al.
patent: 0 459 836 (1991-12-01), None
patent: 55-32026 (1980-03-01), None
patent: 57-083745 (1982-01-01), None
patent: 58-127318 (1983-07-01), None
patent: 58-191420 (1983-10-01), None
patent: 58-191420 (1983-11-01), None
patent: 58-127318 (1984-02-01), None
patent: 60-224282 (1985-11-01), None
patent: 60-227484 (1985-11-01), None
patent: 60-245124 (1985-12-01), None
patent: 60-245125 (1985-12-01), None
patent: 60-257511 (1985-12-01), None
patent: 61-80815 (1986-04-01), None
patent: 61-141174 (1986-06-01), None
patent: 61-152069 (1986-07-01), None
patent: 01-187814 (1988-01-01), None
patent: 63-25933 (1988-02-01), None
patent: 63-159837 (1988-07-01), None
patent: 63-316430 (1988-12-01), None
patent: 01-096929 (1989-04-01), None
patent: 01-119020 (1989-05-01), None
patent: 01-235289 (1989-09-01), None
patent: 1-239837 (1989-09-01), None
patent: 1-241862 (1989-09-01), None
patent: 1-283917 (1989-11-01), None
patent: 01-283917 (1989-11-01), None
patent: 01-286478 (1989-11-01), None
patent: 02-051224 (1990-02-01), None
patent: 02-222154 (1990-09-01), None
patent: 2-255292 (1990-10-01), None
patent: 4-307727 (1991-04-01), None
patent: 03-159119 (1991-07-01), None
patent: 04-011226 (1992-01-01), None
patent: 04-171717 (1992-06-01), None
patent: 4-338631 (1992-11-01), None
patent: 5-21339 (1993-01-01), None
patent: 06-124913 (1994-05-01), None
Merkle et al., “Picosecond Laser Pulse Irradiation of Crystalline Silicon,” Appl. Phys. Lett., vol. 40(8), Apr. 15, 1982, pp. 729-731.
*Jhee et al., “Charge Emission and Precursor Accumulation in the Multiple-Pulse Damage Regime of Silicon,” J. Opt. Soc. Am. B, vol. 2, No. 10, Oct. 1985, pp. 1626-1633.
* Liu et al., “Picosecond Laser-Induce Melting and Resolidification Morphology on Si”, Appl. Phys. Lett. vol. 34(12), Jun. 15, 1979, pp. 864-866.
“Applications of Excimer Lasers in Microelectronics”, Tim McGrath, Lasertechnics, Inc., Albuquerque, New Mexico, Solid State Technology/Dec. 1983, pp. 165-169.
High-Performance TFT's Fabricated by XeC1 Excimer Laser Annealing of Hydrogented Amorphous-Silicon Film, Kenju Sera et al., IEEE Transactions on Electron Devices, vol. 36, No. 12, Dec. 1989, pp. 2868-2872.
Semiconductor World, Chapter 2, Active Element Array Forming Technology Annealing Apparatus, Excimer Laser Annealing Apparatus Leonix, pp. 196-197.
Special Article: Present Situation of Laser Processing Technique, Application of Surface Modification by CO2Laser, Akira Morikawa et al., Laser Group, Engineering Section, Mechatronics Apparatus Division, pp. 68-69.
Excimer Laser Annealed Poly-Crystalline Silicon TFT, Setsuo Kaneko, T. IEEE Japan, vol. 110-A, No. 10, 1990, pp. 679-683.
Semiconductor World, Chapter 2, Active Element Array Forming Technology Annealing Apparatus, Excimer Laser Annealing Apparatus Leonix, 1993, pp. 196-197.
“XeC1 Excimer Laser Annealing Used to Fabricate Poly-Si TFT's”, Toshiyuki Sameshima et al., Japanese Journal of Applied Physics, vol. 28, No. 10, Oct. 1989, pp. 1789-1793.
Pulsed Laser Deposition of Thin Films, Chrisey et al., Section 2.2.2.Excimer Discharge Design, pp. 27-29; A. Wiley—Interscience Corporation, John Wiley & Sons, Inc., New York.
Chinese Office Action dated Jul. 09, 2004 issued in Chinese Patent Application No. 01104515.9 filed Jun. 26, 1993 “A Method of Manufacturing a Semiconductor Device”.
“Improving the Uniformity of Poly-Si Films Using a New Excimer Laser Annealing Method for Giant-Microelectronics”, Hiroyuki Kuriyama et al., Jpn. J. Appl. Phys. vol. 31, Part 1, No. 128, Dec. 1992, pp. 4550-4554.
“p.-28: 3.7-8n,-Diagonal STN-LCD with Stripe Electrode Patterns Fabricated by an Excimer-:Laser Scribing Systems” T. Konuma et al., Semiconductor Energy Laboratory Co., Ltd., 550-553 SID 93 Digest.
Itoga et al., “Laser Re-Crystallization Utilizing Beam Homogenizing Optical System” Japan Society of Applied Physics, Proceedings of 48thAnnual Meetings, 2ndPart, 18 p-6-N-6, p. 537 (1987).

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