Laser/plasma chemical processing of substrates

Details Laser/plasma chemical processing of substrates Laser/plasma chemical processing of substrates

1984-07-24

1986-11-25

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

118 501, 118620, 118728, 156345, 156635, 156646, 156654, 2041923, 204298, 219121LJ, 219121LM, 427 38, 427 531, 427 541, H01L 21306, B44C 122, C03C 1500, C23F 102

Patent

active

046247360

ABSTRACT:
A process for the modification of substrate surfaces is described, wherein etching or deposition at a surface occurs only in the presence of both reactive species and a directed beam of coherent light.

REFERENCES:
patent: 4183780 (1980-01-01), McKenna et al.
patent: 4192706 (1980-03-01), Horiike
patent: 4198261 (1980-04-01), Busta et al.
patent: 4281030 (1981-07-01), Silfvast
patent: 4478677 (1984-10-01), Chen et al.
R. Solanki et al., "Applied Physics Letters", 38(7), Apr. 1, 1981, Laser Photodeposition of Refractory Metals, pp. 572-574.
N. Ianno et al., "Applied Physics Letters", 39(8), Oct. 15, 1981, Plama Annealing of Ion Implanted Semiconductors, pp. 622-624.
R. W. Andreatta et al., "Applied Physics Letters", 40(2), Jan. 15, 1982, Low-Temperature Growth of Polycrystalline Si and Ge Films by Ultraviolet Laser Photodissociation of Silane & Germane, pp. 183-185.
P. K. Boyer et al., "Applied Physics Letters", 40(8), Apr. 15, 1982, Laser-Induced Chemical Vapor Deposition of SiO.sub.2, pp. 716-719.

Affiliated with

Also associated with

Rating

Laser/plasma chemical processing of substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser/plasma chemical processing of substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser/plasma chemical processing of substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1156961