Laser-induced cutting of metal interconnect

Details Laser-induced cutting of metal interconnect Laser-induced cutting of metal interconnect

1997-04-03

2000-05-02

Booth, Richard

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438132, H01L 2144

Patent

active

060572213

ABSTRACT:
An electrical interconnect includes a substrate having an insulating surface upon which is placed an electrically-conductive cut-link pad and a pair of electrically-conductive lines. The lines are bonded to the cut-link pad and are substantially more resistant to heat flow per unit length than is the cut-link pad. In a preferred embodiment, the thermal resistance per unit length of the cut-link pad is lowered by designing the pad such that its width is greater than the width of either of the lines. A method for cutting a circuit includes directing a laser upon the cut-link pad of an interconnect, as described above. The laser is maintained upon the pad until the cut-link pad is ablated, severing the circuit.

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