Laser etching of materials in liquids

Details Laser etching of materials in liquids Laser etching of materials in liquids

1990-04-06

1991-10-15

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156642, 156643, 156654, 1566591, 156662, 156663, 156667, 156345, 21912169, 21912185, B44C 122, C03C 1500, C03C 2506, C23F 102

Patent

active

050571842

ABSTRACT:
Laser etching of a substrate in a liquid is accomplished by laser induced sonic cavitation at the substrate surface. The preferred substrate is laser energy absorbing and has a finite melting temperature. The preferred liquid is an organic or inorganic inert liquid which does not chemically react with the substrate at room temperature. The laser is preferably a copper vapor laser but a chopped beam cw argon ion laser or a YAG laser adjusted to a low power output sufficient to avoid the formation of a recast layer can also be used. The laser parameters are adjusted for causing the growth and collapse of bubbles at the substrate surface. The laser etching has particular application in the fabrication of rails in magnetic head sliders and dicing of Al.sub.2 O.sub.3 --TiC, TiC, SiC, Si/SiO.sub.2, and laser energy absorbing metal and metal oxides.

REFERENCES:
patent: 4876690 (1989-10-01), Nishida et al.
patent: 4904340 (1990-02-01), Miracky et al.
F. V. Bunkin et al, "Si Etching Affected by IR Laser Irradiation" Appl. Phys., vol. A37, 117-119, 1985.
T. Shiosaki et al, "Laser Micromachining of a Modified PbTiO.sub.3 Ceramics in KOH Water Solution", Jpn. J. Appl. Phy. vol. 22, Suppl. 22--2, 109-112 (1983).
K. Koyabu et al, "Laser--assisted Etching for Al.sub.2 O.sub.3 /TiC Ceramics with Nd:YAG Laser and KOH Solution", J. Cer. Soc. of Jpn, vol. 96, C--39-C--43.
E. K. Yung et al, "Laser--Assisted Etching of Manganese--Zinc--Ferrite" J. Electrochem. Soc., vol. 136, No. 3, 665-673, Mar., 1989.
R. J. von Gutfield et al, "Laser Enhance Etching in KOH", Appl. Phys. Lett., vol. 40(4) Feb. 15, 1982, pp. 352-354.
N. Morita et al, "Pulsed Laser Processing of Ceramics in Water", Appl. Phys. Lett., vol. 52(23), Jun. 6, 1988, 1965-1966.
V. G. Vol'ter et al, "Low--pressure pulsed CO.sub.2 laser and its use for Scribing Pyroceramic Plates", Sov. J. Opt. Technol, vol. 45(6) Jun., 1978 pp. 376-378.

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