Laser etch-back process for forming a metal feature on a non-met

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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437173, 156634, 21912168, H01L 21306

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active

052214265

ABSTRACT:
An improved laser etch-back process forms a metal feature on an area of a polymeric or other non-metallic substrate. The process comprises forming a metal layer on the area that includes a first, relatively thick section, and a second, relatively thin section. Thereafter, the metal layer is uniformly irradiated with a laser pulse, but not to vaporize metal from the thick section. Thus, the laser pulse selectively etches the thin section to remove the metal and expose the substrate, without disturbing the thick section, which forms the desired metal feature.

REFERENCES:
patent: 4388517 (1983-06-01), Schulte et al.
patent: 4448636 (1984-05-01), Baber
patent: 4644130 (1987-02-01), Bachmann
patent: 4684437 (1987-08-01), Donelon et al.
patent: 4880959 (1989-11-01), Baum et al.
patent: 5032233 (1991-06-01), Yu et al.
patent: 5066611 (1991-11-01), Yu
patent: 5093279 (1992-03-01), Andreshak et al.
Metal Finishing Guidebook Directory 1987, Metals and Plastic Publication, Inc. (1987) pp. 212-213.

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