Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-11-29
1993-06-22
Hearn, Brian E.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
437173, 156634, 21912168, H01L 21306
Patent
active
052214265
ABSTRACT:
An improved laser etch-back process forms a metal feature on an area of a polymeric or other non-metallic substrate. The process comprises forming a metal layer on the area that includes a first, relatively thick section, and a second, relatively thin section. Thereafter, the metal layer is uniformly irradiated with a laser pulse, but not to vaporize metal from the thick section. Thus, the laser pulse selectively etches the thin section to remove the metal and expose the substrate, without disturbing the thick section, which forms the desired metal feature.
REFERENCES:
patent: 4388517 (1983-06-01), Schulte et al.
patent: 4448636 (1984-05-01), Baber
patent: 4644130 (1987-02-01), Bachmann
patent: 4684437 (1987-08-01), Donelon et al.
patent: 4880959 (1989-11-01), Baum et al.
patent: 5032233 (1991-06-01), Yu et al.
patent: 5066611 (1991-11-01), Yu
patent: 5093279 (1992-03-01), Andreshak et al.
Metal Finishing Guidebook Directory 1987, Metals and Plastic Publication, Inc. (1987) pp. 212-213.
Hoffman William F.
Stafford John W.
Tessier Theodore G.
Fekete Douglas D.
Fleck Linda J.
Hearn Brian E.
Motorola Inc.
LandOfFree
Laser etch-back process for forming a metal feature on a non-met does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Laser etch-back process for forming a metal feature on a non-met, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser etch-back process for forming a metal feature on a non-met will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1439258