Laser-broken fuse

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

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Details

257754, 257758, 257760, 257775, H01L 2702, H01L 2348

Patent

active

053213009

ABSTRACT:
In a laser-broken fuse used in a memory redundancy technique, an aluminum wiring layer is formed on an interlevel insulating film. A portion of the wiring layer is selected to be broken to shut off conduction of the layer. A polysilicon-made heat member is provided in the interlevel insulating film at the place which is underneath the selected portion. The heat member is located on a field insulating film. This heat member generates heat by absorbing energy from a laser beam, and thermal-explodes in a sealed atmosphere so as to break the selected portion.

REFERENCES:
patent: 4826785 (1989-05-01), McClure et al.
patent: 4935801 (1990-06-01), McClure et al.

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