Laser bonding of microelectronic circuits

Details Laser bonding of microelectronic circuits Laser bonding of microelectronic circuits

1981-09-10

1983-09-13

Albritton, C. L.

Electric heating

Metal heating

By arc

219121LF, B23K 2700

Patent

active

044044534

ABSTRACT:
In securing a semiconductor chip to a substrate of ceramic material or the like, a de-focused laser beam having a wave length to which the substrate is substantially opaque is directed over a relatively large area of the reverse side of the substrate. Heat generated at the reverse side of the substrate then flows through the substrate to heat bonding material that is placed between the engaging surfaces of the chip and substrate. In this manner direct heating of the chip is avoided or minimized, and damage to both chip and substrate is also minimized.

REFERENCES:
patent: 3480775 (1969-11-01), Beesley et al.
patent: 3614832 (1971-10-01), Chance et al.
patent: 4250374 (1981-02-01), Tani
patent: 4278867 (1981-07-01), Tan
Burns, F. & Zyetz, C. "Laser Microsoldering" in Electronic Packaging and Production, May 1981, pp. 109-120.

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