Laser beam scanning method for forming via holes in polymer mate

Details Laser beam scanning method for forming via holes in polymer mate Laser beam scanning method for forming via holes in polymer mate

1989-02-14

1990-01-16

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134 1, 156644, 156651, 156655, 156668, 156345, 20419236, 21912169, 21912185, B44C 122, B29C 3700, C03C 1500, C03C 2506

Patent

active

048941158

ABSTRACT:
The surface of a polymer dielectric layer is scanned repeatedly with a high energy continuous wave laser in a pattern to create via holes of desired size, shape and depth. This is followed by a short plasma etch. The via holes are produced at commercial production rates under direct computer control without use of masks and without damage to conductor material underlying the dielectric layer. A two-step technique usable to form a large hole to a partial depth in the dielectric layer and several smaller diameter holes within the large hole through the remainder of the dielectric layer depth allows formation of a large number of holes in a given area of a thick dielectric layer.

REFERENCES:
patent: 4617085 (1986-10-01), Cole, Jr. et al.
patent: 4714516 (1987-12-01), Eichelberger et al.
patent: 4764485 (1988-08-01), Loughran et al.
patent: 4780177 (1988-10-01), Wojnarowski et al.
H. S. Cole et al., Laser Processing for Interconnect Technology, SPIE vol. 877 Micro-Optoelectronic Materials (1988), pp. 92-96.

Affiliated with

Also associated with

Rating

Laser beam scanning method for forming via holes in polymer mate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser beam scanning method for forming via holes in polymer mate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser beam scanning method for forming via holes in polymer mate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1333243