Laser beam machining method

Plastic and nonmetallic article shaping or treating: processes – Laser ablative shaping or piercing

Reexamination Certificate

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Reexamination Certificate

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07608214

ABSTRACT:
To provide a laser processing method which can highly accurately cut a planar object to be processed having an irregular surface as an entrance surface for processing laser light.This laser processing method irradiates a planar object to be processed with laser light while locating a light-converging point within the object, thereby forming modified regions71to77to become a starting point region for cutting along lines to cut5. The entrance surface r for the laser light in the object is an irregular surface. The lines to cut5extend over a depressed area surface r2and a protruded area surface r1in the entrance surface r. The modified region71is formed inside by a predetermined distance from the depressed area surface r2. At the time of irradiation with laser light along a part51aon the protruded area surface r1, the light-converging point is located on the outside of the object. The modified region72is formed inside by a predetermined distance from the protruded area surface r1. At the time of irradiation with laser light along a part51bon the depressed area surface r2, the light-converging point is located on the outside of the object.

REFERENCES:
patent: 6992026 (2006-01-01), Fukuyo et al.
patent: 2004/0002199 (2004-01-01), Fukuyo et al.
patent: 2006/0144828 (2006-07-01), Fukumitsu et al.
patent: 1 595 637 (2005-11-01), None
patent: 1 707 298 (2006-10-01), None
patent: 1 712 322 (2006-10-01), None
patent: 1 716 960 (2006-11-01), None
patent: 2002-192371 (2002-07-01), None
patent: 2002-219591 (2002-08-01), None
patent: 2003-266185 (2003-09-01), None
patent: WO-2004/052586 (2004-06-01), None
patent: WO 2004/052586 (2004-06-01), None
patent: WO 2005/065880 (2005-07-01), None
patent: WO 2005/065881 (2005-07-01), None
patent: WO 2005/065882 (2005-07-01), None
K. Arai, “Laser dicing process for Si wafer,” Journal of the Japan Society for Abrasive Technology, vol. 47, No. 5, May 2003, pp. 229-231 (w/English language translation).
K. Hayashi; “Inner Glass Marking by Harmonics of Solid-State Laser”, Proceedings of 45thLaser Materials Processing Conference, Dec. 1998, pp. 23-28.
K. Miura et al., “Formation of Photo-Induced Structures in Glasses with Femtosecond Laser”, Proceedings of 42ndLaser Materials Processing Conference, Nov. 1997, pp. 105-111.
T. Sano et al., “Evaluation of Processing Characteristics of Silicon with Picosecond Pulse Laser”, Preprints of the National Meeting of Japan Welding Society, No. 66, Apr. 2000, pp. 72-73 (with at least partial English translation).

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