Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-05-27
2008-05-27
Dang, Phuc T (Department: 2892)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
Reexamination Certificate
active
07378337
ABSTRACT:
Terminating the ends of passive electronic components entails applying a laser-removable coating to one or both of the opposed major surfaces of a substrate. A UV laser beam having a spot size and an energy distribution sufficient to remove the laser-removable coating from multiple selected regions of at least one of the major surfaces to which the laser-removable coating was applied is directed for incidence on the substrate. Relative motion between the UV laser beam and substrate effects removal of sufficient amounts of laser-removable coating to expose the multiple selected regions. The substrate is then broken into multiple rowbars or individual components, each of which includes side margins. An electrically conductive material is applied to the side margins to form electrically conductive interconnects between portions of the side margins spatially aligned with the multiple selected regions.
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Garcia Douglas J.
Goldwater Bruce Stuart
Swenson Edward J.
Dang Phuc T
Electro Scientific Industries Inc.
Stoel Rives LLP
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