Laser based splitting method, object to be split, and...

Details Laser based splitting method, object to be split, and... Laser based splitting method, object to be split, and...

2007-05-01

2007-05-01

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

Radiation or energy treatment modifying properties of...

Compound semiconductor

C438S463000, C438S106000, C438S113000, C438S667000, C438S584000, C438S462000, C219S121670, C219S121720, C257S620000

Reexamination Certificate

active

11058163

ABSTRACT:
A laser splitting method for splitting off a segment from an object to be split using a laser beam, includes a surface processing step of processing the object by forming a linear recessed portion in a surface of the object, the linear recessed portion being effective to cause a stress concentration at the surface of the object; an internal processed-region forming step of forming an internal processed-regions at a depth of the object in a line along which a laser beam scans the surface of the object by a relative motion therebetween, the laser beam being converged adjacent the depth, wherein the thus formed internal processed-regions extend in a direction substantially perpendicular to the surface of the object; and an external force applying step of applying an external force to the object to form cracks between the recessed portion and the internal processed-regions.

REFERENCES:
patent: 6744009 (2004-06-01), Xuan et al.
patent: 6856023 (2005-02-01), Muta et al.
patent: 6992026 (2006-01-01), Fukuyo et al.
patent: 2004/0002199 (2004-01-01), Fukuyo et al.
patent: 2002-192370 (2002-07-01), None
patent: 2002-205180 (2002-07-01), None
patent: 2003-334675 (2003-11-01), None
patent: WO 03/076119 (2003-09-01), None

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