Laser-assisted liquid-phase etching of copper conductors

Details Laser-assisted liquid-phase etching of copper conductors Laser-assisted liquid-phase etching of copper conductors

1988-10-31

1990-02-27

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 156666, 156345, 156902, 21912169, 21912185, 252 792, 252 794, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

049043404

ABSTRACT:
A process for laser-assisted liquid phase etching of copper conductors which includes the use of a solution of sulfuric acid and hydrogen peroxide in contact with an integrated circuit substrate and the provision of a laser beam to select substrate areas having copper conductors to be etched. Also disclosed is an apparatus for the laser-assisted etching.

REFERENCES:
patent: 3412032 (1968-11-01), Jenks
patent: 4283259 (1981-08-01), Melcher et al.
patent: 4395302 (1983-07-01), Courduvelis
patent: 4401509 (1983-08-01), Schellinger
patent: 4518456 (1985-05-01), Bjorkholm
Gutfeld, "Laser-Enhanced Plating and Etching for Microelectronic Applications", IEEE Circuits and Devices Magazine, Jan. 1986, pp. 57-60.
Silversmith, "Laser Direct Write Technologies as Tools for Gate-Array Development", Mat. Res. Soc. Symp. Proc., vol. 29, 1984, pp. 55-59.
J. Tsao, "Laser-Controlled Wet Chemical Etching for Corrective Trimming of Thin Films", J. Electrochem. Soc., vol. 133, No. 11, Nov. 1986, pp. 2244-2248.
Tuckerman, "Laser-Patterned Interconnect for Thin-Film Hybrid Water-Scale Circuits", IEEE Electron Device Letters, vol. EDL-8, No. 11, Nov. 1987, pp. 540-543.
Jensen, "Copper-Polyimide Materials System for High Performance Packaging", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-7, No. 4, Dec. 1984, pp. 384-393.
Hart, "Bright Dipping and Etching of Copper-Based Materials in Solutions of Sulphyric Acid and Hydrogen Peroxide, Trans. Inst. Metal Finishing", vol. 61, 1983, pp. 46-49.
Luke, "Etching of Copper with Sulphuric Acid/Hydrogen Peroxide Solutions", Trans. Inst. Metal Finishing, vol. 62(3), 1984, pp. 81-82.

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