Laser ablation of electronic devices

Details Laser ablation of electronic devices Laser ablation of electronic devices

2006-08-31

2011-11-22

Geyer, Scott B (Department: 2812)

Semiconductor device manufacturing: process

Radiation or energy treatment modifying properties of...

C438S690000

Reexamination Certificate

active

08062984

ABSTRACT:
A method of fabricating an electronic device, the device including a plurality of layers on a substrate, the layers including an upper conductive layer and at least one patterned underlying layer between said conductive layer and said substrate. The method includes patterning said underlying layer, and patterning said upper conductive layer by laser ablation using a stepwise process in which successive areas of said upper conductive layer are ablated by successively applied laser patterns. The successively applied laser patterns overlap one another in an overlap region. The method further includes configuring a said laser pattern and said patterned underlying layer with respect to one another such that in a said overlap region said patterned underlying layer is substantially undamaged by said stepwise laser ablation.

REFERENCES:
patent: 5446521 (1995-08-01), Hainsey et al.
patent: 5723236 (1998-03-01), Inoue et al.
patent: 5972543 (1999-10-01), Yokoyama et al.
patent: 6285001 (2001-09-01), Fleming et al.
patent: 6719916 (2004-04-01), Dubowski et al.
patent: 2001/0015438 (2001-08-01), Callegari et al.
patent: 2002/0102478 (2002-08-01), Hasegawa et al.
patent: 2004/0137142 (2004-07-01), Nishikawa
patent: 2005/0009248 (2005-01-01), Weng et al.
patent: 2009/0009812 (2009-01-01), Sirringhaus et al.
patent: 2009/0212292 (2009-08-01), Hayton et al.
patent: 1 443 556 (2004-08-01), None
patent: WO 99/10939 (1999-03-01), None
patent: WO 2004/060600 (2004-07-01), None
Aug. 31, 2006 International Preliminary Report on Patentability for PCT/GB2006/050265.
Bao, Z. et al., “High Performance Plastic Transistors Fabricated by Printing Techniques,” Chem. Mat. 9, 1299-1301 (1997).
Bao, Z., “Materials and Fabrication Needs for Low-Cost Organic Transistor Circuits” Advanced Materials 12, vol. 3, p. 227-230 (2000).
Brittain, S. et al., “Soft Lithography and Microfabrication” Physics World, vol. 11, No. 5, p. 31, (May 1998).
Duan, X., “High performance thin film transistors assembled from semiconductor nanowires and nanoribbons” Nature 425, 274-278 (2003).
Jolik et al., “Fabrication of three-dimensional inductor coil using excimer laser micromachining.” Journal of Micromechanics and Microengineering, Institute of Physics Publishing, 13(5):782-789 (Sep. 1, 2003).
Kagan, C.R. et al., “Organic-Inorganic Hybrid Materials as Semiconducting Channels in Thin-Film Field-Effect Transistors” Science 286, No. 5441, p. 946 (1999).
Katz, H.E., “Organic molecular solids as thin film transistor semiconductors,” J. Mater. Chem. vol. 7, Issue 3, p. 369-572 (1997).
Laquindanum, J.G. et al., “Synthesis, Morphology, and Field-Effect Mobility of Anthradithiophenes” J. Am. Chem. Soc. 120, p. 664-672 (1998).
International Search Report issued in application No. PCT/GB2006/050265 on Nov. 27, 2006.
Ridley, B.A. et al., “All-Inorganic Field Effect Transistors Fabricated by Printing” Science 286, No. 5440, p. 746-749 (1999).
Rogers, J.A. et al., “Low-Voltage 0.1 pm organic transistors and complementary inverter circuits fabricated with a low-cost form of near-field photolithography,” Appl. Phys. Lett. 75, No. 7, p. 1010 (1999).

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