Large substrate structural vias

Details Large substrate structural vias Large substrate structural vias

2011-08-30

2011-08-30

Potter, Roy K (Department: 2822)

Semiconductor device manufacturing: process

Making device array and selectively interconnecting

C438S639000, C257SE23010

Reexamination Certificate

active

08008134

ABSTRACT:
An electronic package and methods by which the package reduces thermal fatigue failure of conductors in the electronic package. The electronic package includes a carrier substrate having first and second surfaces and a plurality of anchor vias having a via material extending from the first surface toward the second surface. The electronic package includes a first conducting layer having a length and a width extending laterally in two dimensions across a major part of the first surface of the carrier substrate. The anchor vias have plural attachments along the length and the width of the first conducting layer to secure the first conducting layer to the carrier substrate.

REFERENCES:
patent: 5172310 (1992-12-01), Deam et al.
patent: 5208491 (1993-05-01), Ebeling et al.
patent: 5236118 (1993-08-01), Bower et al.
patent: 5511428 (1996-04-01), Goldberg et al.
patent: 5619071 (1997-04-01), Myers et al.
patent: 5655290 (1997-08-01), Moresco et al.
patent: 5790771 (1998-08-01), Culbertson et al.
patent: 5805533 (1998-09-01), Daigle et al.
patent: 5834705 (1998-11-01), Jonaidi
patent: 5891761 (1999-04-01), Vindasius et al.
patent: 5949030 (1999-09-01), Fasano et al.
patent: 6096411 (2000-08-01), Nakatani et al.
patent: 6206705 (2001-03-01), Bolotin et al.
patent: 6221769 (2001-04-01), Dhong et al.
patent: 6259160 (2001-07-01), Lopatin et al.
patent: 6379982 (2002-04-01), Ahn et al.
patent: 6555467 (2003-04-01), Hsu et al.
patent: 6598216 (2003-07-01), Chan et al.
patent: 6650301 (2003-11-01), Zimmerman
patent: 6660564 (2003-12-01), Brady
patent: 6694464 (2004-02-01), Quayle et al.
patent: 6768205 (2004-07-01), Taniguchi et al.
patent: 7048548 (2006-05-01), Mattieu et al.
patent: 7409610 (2008-08-01), Drimer
patent: 2002/0134581 (2002-09-01), Figueroa et al.
patent: 2002/0134685 (2002-09-01), Chakravorty et al.
patent: 2002/0163062 (2002-11-01), Wang et al.
patent: 2003/0107117 (2003-06-01), Antonell et al.
patent: 2004/0038195 (2004-02-01), Nerenberg et al.
patent: 2004/0179344 (2004-09-01), Uchida et al.
patent: 2005/0104221 (2005-05-01), Memis
patent: 2006/0027934 (2006-02-01), Edelstein et al.
patent: 2006/0125094 (2006-06-01), Lin
patent: 2006/0170110 (2006-08-01), Akram et al.
patent: 2006/0190846 (2006-08-01), Hichri et al.
patent: 2006/0226450 (2006-10-01), Furuta et al.
patent: 2007/0012475 (2007-01-01), Kawaguchi et al.
patent: 2007/0210400 (2007-09-01), Moribayashi et al.
patent: 2008/0054486 (2008-03-01), Murayama et al.
patent: 2008/0253085 (2008-10-01), Soffer

Affiliated with

Also associated with

Rating

Large substrate structural vias does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Large substrate structural vias, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Large substrate structural vias will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2760754