4. Horology: time measuring systems or devices
  5. Time interval
  6. Electrical or electromechanical

Robert O. Conn

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Bond and back side etchback transistor fabrication process

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
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Bond and back side etchback transistor fabrication process

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Built-in AC self test using pulse generators

Horology: time measuring systems or devices – Time interval – Electrical or electromechanical
Reexamination Certificate

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Built-in self test method for measuring clock to out delays

Horology: time measuring systems or devices – Time interval – Electrical or electromechanical
Reexamination Certificate

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Built-in self test method for measuring clock to out delays

Horology: time measuring systems or devices – Time interval – Electrical or electromechanical
Reexamination Certificate

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Profile ID: LFUS-PAI-P-741515

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