Large scale integrated package structure

Details Large scale integrated package structure Large scale integrated package structure

1993-07-29

1994-07-05

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361761, 361785, 361791, 439 44, 439 46, H05K 702, H01R 2368, H01R 2900

Patent

active

053273265

ABSTRACT:
An LSI package structure with high efficiency of the power supply and fast transmission of the signal is provided in which: adjacent to a pin 8 side surface of an LSI package 1, a power supply member 2 having an electrically conductive portions 6 and 7 for power supply bus and ground bus respectively, and a flexible interconnection board 3 having a power supply pattern layer 3b and a ground pattern layer 3a connected to the portions 6 and 7 respectively via a pin 9, are disposed; the pins 8 and 9 each extend through a through hole 3c formed on the interconnection board 3, the power supply pattern layer 3b and the pins 8 and 9 for power supply being interconnected within the through hole, the ground pattern layer 3a and the pins 8 and 9 for grounding being interconnected within the through hole; and the signal input/output pin 8 and a connector 5 of a signal input/output coaxial cable 5a are interconnected at the side of the interconnection board 3 oppsite the LSI package 1.

REFERENCES:
patent: 3027534 (1962-03-01), Deakin
patent: 4039902 (1977-08-01), Lacan et al.
patent: 4567654 (1986-02-01), Kloenne et al.
patent: 5073124 (1991-12-01), Powell
T. Watari and A. Dohya, "High Performance Packaging Technology for Supercomputers", IEICE Transactions, vol. E 74, No. 8, Aug. 1991, pp. 2331-2336.

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