Large line conductive pads for interconnection of stackable...

Details Large line conductive pads for interconnection of stackable... Large line conductive pads for interconnection of stackable...

2005-03-15

2005-03-15

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S670000, C438S761000

Reexamination Certificate

active

06867132

ABSTRACT:
Digital circuitry, such as interconnective pads which are patterned as waffles according to the embossing methods for flexible substrates which are disclosed, so as to be especially suited for the interconnection of stacks of circuitry blocks forming digital memory known as Permanent Inexpensive, Rugged Memory (PIRM) cross point arrays.

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Juskey, F. et al. “Cross Hatched Pad Design for Bonding EL Panels to PCB's using Z-Axis Adhesives”, Motorola Tech. Develop., Motorola Inc., Schaumburg, IL., US, vol. 19 Jun. 1, 1993.

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