Large area substrate processing system

Details Large area substrate processing system Large area substrate processing system

2005-05-24

2005-05-24

Lu, Jiping (Department: 3749)

Heating

Work chamber having heating means

Having means by which work is progressed or moved mechanically

C432S005000, C432S011000, C118S719000, C118S724000, C118S725000, C414S935000, C414S937000, C414S940000

Reexamination Certificate

active

06896513

ABSTRACT:
A system and method for processing large area substrates is provided. In one embodiment, a processing system includes a transfer chamber having at least one processing chamber and a substrate staging system coupled thereto. The staging system includes a load lock chamber having a first port coupled to the transfer chamber and a heat treating station coupled to a second port of the load lock chamber. A load lock robot is disposed in the load lock chamber to facilitate transfer between the heat treating station and the load lock chamber.

REFERENCES:
patent: 4819496 (1989-04-01), Shelef
patent: 5636964 (1997-06-01), Somekh et al.
patent: 5993141 (1999-11-01), Wytman
patent: 6026703 (2000-02-01), Stanisic et al.
patent: 6069420 (2000-05-01), Mizzi et al.
patent: 6142722 (2000-11-01), Genov et al.
patent: 6176668 (2001-01-01), Kurita et al.
patent: 6270582 (2001-08-01), Rivkin et al.
patent: 6312525 (2001-11-01), Bright et al.
patent: 6371713 (2002-04-01), Nishimura et al.
patent: 6379095 (2002-04-01), Elliott et al.
patent: 6530993 (2003-03-01), Hwang et al.
patent: 20020005168 (2002-01-01), Kraus et al.
patent: 20020061248 (2002-05-01), Tepman
patent: 1189275 (2002-03-01), None
patent: 09246347 (1997-09-01), None
patent: 09283590 (1997-10-01), None
patent: WO02056349 (2002-07-01), None
U.S. Appl. No. 09/505,901, filed Feb. 17, 2002, Fairbairn.
International Search Report PCT/US03/28813, dated May 7, 2004 (APPM/7037PCT).

Affiliated with

Also associated with

Rating

Large area substrate processing system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Large area substrate processing system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Large area substrate processing system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3450009