Large area sputter cathode having floating target segments

Details Large area sputter cathode having floating target segments Large area sputter cathode having floating target segments

1995-05-23

1996-07-16

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429812, 20429823, C23C 1434

Patent

active

055363806

ABSTRACT:
Individual target segments (A-F), are mounted on a mounting plate by means of locating studs inserted into mounting holes of elongate or circular cross sections in correspondence with the change in length caused by the thermal expansion of the target segments. The segments are retained by screws received in tapped bones in the studs, which are welded to the target backplates. The individual segments (A-F) each consist of a target backplate and a target bonded to the backplate. The perimeter of each backplate over laps the perimeter of each target segment, this overlap amounting to 0.05-0.2 mm when molybdenum or titanium is used for the target backplate and an indium-tin alloy is used for the sputter target.

REFERENCES:
patent: 4515675 (1985-05-01), Kieser et al.
patent: 4668373 (1987-05-01), Rille et al.
patent: 4747927 (1988-07-01), Rille et al.
patent: 4966676 (1990-10-01), Fukasawa et al.
patent: 5039913 (1991-08-01), Wegmann et al.
patent: 5203980 (1993-12-01), Cremer et al.
patent: 5372694 (1994-12-01), Szczyrbowski
patent: 5421978 (1995-06-01), Schuhmacher et al.

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