Lapping means and method

Details Lapping means and method Lapping means and method

1989-10-05

1990-07-10

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

51317, 156662, 156345, B44C 122, H01L 21306, C03C 1500, C03C 2506

Patent

active

049405071

ABSTRACT:
An improved means and method for polishing or lapping thin wafers, especially semiconductor wafers, in a lapping plate is obtained by providing additional slurry holes in the lapping plate between the wafer receiving holes. In a first embodiment useful with wafers having a small initial taper, the additional slurry holes are radially oriented and have a length about equal to the wafer diameter so that, as the lapping plate rotates in the lap machine, the lapping slurry feeds through the holes to providing slurry uniformly to the underside of the wafers being lapped. In a second embodiment useful for wafers with a large initial taper, slurry holes of varying width and/or length are used to vary the amount of slurry reaching different parts of the wafers so that a predetermined variation in lapping occurs across the wafer to correct the taper. Yield is thereby improved.

REFERENCES:
patent: 3549439 (1970-12-01), Kaveggia et al.
patent: 4826563 (1989-05-01), Hassett et al.

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