Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2008-09-30
2008-09-30
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257S787000, C257S773000, C257S786000, C257SE23116
Reexamination Certificate
active
11190596
ABSTRACT:
A semiconductor device has a substrate and an encapsulation area on a first surface of the substrate. A first plurality of metal lands is on the first surface of the substrate around a periphery of the encapsulation area. Solder mask covers portions of the first plurality of metal lands closest to the encapsulation area. Remaining portions of the first plurality of metal lands are exposed areas having no solder mask.
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Dreiza Mahmoud
Yoshida Akito
Amkor Technology Inc.
Parekh Nitin
Weiss & Moy P.C.
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