Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-06-14
2005-06-14
Thai, Luan (Department: 2827)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S637000, C438S638000, C438S639000
Reexamination Certificate
active
06905961
ABSTRACT:
A flexible chip carrier with contact pads on its upper surface matching those of the chip with said pads conductively connected to land grid array (LGA) pads on its lower surface matching the those of a card or PCB. The chip carrier is provided with a stiffening layer at the LGA interface. The stiffening layer is mechanically attached to the lower surface of the chip carrier. Holes are formed in the stiffening layer to expose the LGA pads. The holes are then filled with a conductive adhesive material. Compliant LGA bumps are applied to the uncured conductive adhesive material which material is then cured.
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Caletka David Vincent
Darbha Krishna
Infantolino William
Johnson Eric Arthur
International Business Machines - Corporation
Jordan John A.
Steinberg William H.
Thai Luan
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