Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1993-01-25
1994-04-12
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257718, 257727, H01L 2302, H01L 2312, H01L 2342, H01L 2344
Patent
active
053028538
ABSTRACT:
A combination heat sink (18, 41, 43) and circuit interface comprises a metallic wafer (15) disposed between an integrated circuit (11) and a printed circuit board (14) in a land grid array package (10). A frame (13) for the integrated circuit (11) is nested within the heat sink (18, 41, 43) and a latch (30) is pivotably mounted on the frame (13) for retaining the overall package (10). The circuit interface comprises a plurality of flexible electrical connectors (19) mounted on the wafer (15).
REFERENCES:
patent: 3568001 (1971-03-01), Straus
patent: 4390220 (1983-06-01), Benasutti
patent: 4692790 (1987-09-01), Oyamada
patent: 4725922 (1988-02-01), Matsuoka
patent: 4744009 (1988-05-01), Grabbe et al.
patent: 4760495 (1988-07-01), Till
patent: 4923404 (1990-05-01), Redmond et al.
patent: 4933808 (1990-06-01), Horton et al.
patent: 4954878 (1990-09-01), Fox et al.
patent: 5065227 (1991-11-01), Frankeny et al.
patent: 5102829 (1992-04-01), Cohn
Bates Warren A.
Deak Frederick R.
Irlbeck Robert D.
Johnson David C.
Renn Robert M.
Clark Sheila V.
Noll William B.
The Whitaker Corporation
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