Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2008-10-10
2010-06-15
Harvey, James (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S086000, C439S931000
Reexamination Certificate
active
07736152
ABSTRACT:
Methods for fabricating Land Grid Array (LGA) interposer contacts that are both conducting and elastic. Also provided are LGA interposer contacts as produced by the inventive methods. Provided is LGA type which utilizes a pure unfilled elastomer button core that is covered with an electrically-conductive material that is continuous from the top surface to the bottom surface of the button structure. In order to obviate the disadvantages and drawbacks which are presently encountered in the technology pertaining to the fabrication and structure of land grid arrays using electrically-conductive interposer contacts, there is provided both methods and structure for molding elastomer buttons into premetallized LGA carrier sheets, and wherein the non-conductive elastomer buttons are surface-metallized in order to convert them into conductive electrical contacts.
REFERENCES:
patent: 4070077 (1978-01-01), Clark
patent: 4181385 (1980-01-01), DeSantis et al.
patent: 4813129 (1989-03-01), Karnezos
patent: 5599193 (1997-02-01), Crotzer
patent: 5624268 (1997-04-01), Maeda et al.
patent: 6046410 (2000-04-01), Wojnarowski et al.
patent: 6224394 (2001-05-01), Matsumoto
patent: 6814584 (2004-11-01), Zaderej
patent: 7070419 (2006-07-01), Brown et al.
patent: 7113408 (2006-09-01), Brown et al.
patent: 7137827 (2006-11-01), Hougham et al.
patent: 2002/0022383 (2002-02-01), Sakata et al.
patent: 2006/0003648 (2006-01-01), Hougham et al.
patent: 02-043558 (1990-02-01), None
patent: 08-287983 (1996-11-01), None
patent: 08-306416 (1996-11-01), None
patent: 2000-315533 (2000-11-01), None
patent: WO 01/89038 (2001-11-01), None
“Metallized Elastomeric Bumps for Chip and Zero Insertion Force Connectors”, IBM Technical Disclosure Bulletin, IBM Corp., New York, vol. 37, No. 9; Sep. 1, 1994, p. 625 (XP 000475526).
Fogel Keith E.
Hougham Gareth G.
Lauro Paul A.
Zinter, Jr. Joseph
Harvey James
International Business Machines - Corporation
Morris, Esq. Daniels P.
Scully , Scott, Murphy & Presser, P.C.
LandOfFree
Land grid array fabrication using elastomer core and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Land grid array fabrication using elastomer core and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Land grid array fabrication using elastomer core and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4177550